De 18 Labelexpho Americas erat grandem tenuit a Septembris Xth- XIIthIn Donald E. Stephens Convention Center. Vicis attracted plus quam CD exhibitors ex toto orbe terrarum, et deduxerunt variis tardus technology et apparatu. Hic, visitatores potest testis tardus rfid technology, flexibilia packaging technology, traditional et digital hybrid printing technology, tum variis provectus digital et packaging automation cutting apparatu.
Iecho participatur in hac se ferre duo classic label velit, lct et rk2. Haec duo machinis specifically tailored ad Pittacium foro, in occursum in foro scriptor demanda ad efficient, precise et automated apparatu.
Bothis Number: C-MMMDXXXIV
LCT laser mori-secans apparatus est maxime disposito aliquamdiu parva-batch, personalized et urgente Orders.The Max secare Width in Machina est 350mm, et laser Dracionarius est, quod automatic in VIII M / S.The Platform esto, et in alium laser processing modes such as roll-to-roll, roll-to-sheet, sheet-to-sheet, etc. It also supports synchronous film covering, one-click positioning, digital image changing, multi process cutting, slitting, and sheet breaking functions,providing a better and faster solution for small orders and shorter lead times.
RK2 est digital secans apparatus ad processui auto-tenaces materiae, et integrates ad munera laminating, cutting, slitting, curva, et perditio missionem. Combined cum Web Ducatus System, High-Precision Portum Cutting, et intelligentes multi-secans caput imperium technology, potest animadverto efficace volumine-to-volumine secans et Lorem continua processu et magni melius productum et uber emendat.
Ad exhibitionem site, visitatores potest observare et experientiam hi provectus cogitationes ad proxima range intelligere applications et commoda in ipsa productio. Iecho quondam iterum ostendit in innovative vires digital titing agro in se ferre, attrahens operam multorum in industria.
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Post tempus: Sep, 14-2024